BRESSNER Technology GmbH - Logo

Empowered by Hardware Solutions

MX1-10FEP-D Series

Rugged embedded PC for GPU computing with Intel® Core™/ Xeon® 9th/ 8th Gen CPUs

FEATURES

  • Intel® Core™/ Xeon® 9th/8th Gen
  • Up to 32GB DDR4 2666MHz RAM
  • 3x 2.5″ SATA Drive Bays
  • With fan or fanless
  • Operating temp.: -40 °C ~ 70 °C
  • Dimensions: 268 x 128 x 246mm
SKU: 25389

Description

MX1-10FEP-D Series – Fanless sturdy design

The fanless embedded GPU computing platforms of the MX1-10FEP-D series are based on Intel® Xeon® or Core™ processors of the ninth or eighth generation and are optimized for applications in industrial automation and machine control. The MX1-10FEP-D combines high-performance computing, scalable functions and versatile interfaces as well as industrial-grade reliability on a fanless platform and offers reliable long-term operation for performance-critical applications in industrial automation, visualization and computationally intensive processes. The Embedded PC series consists of a classically robust design. The Embedded PCs support DDR4 memory via dual SODIMM slots, both non-ECC and ECC.

High performance for industrial requirements

The embedded systems combine outstanding performance with extensive connectivity and are easy to use. The robust housing allows the use under difficult conditions. With the use of a LGA1151 socket, optionally with Intel® Xeon® Coffee Lake or Core™ i3, i5, i7 or even i9 processor of the current generation, the embedded computer focuses on high performance with minimal power consumption. Together with unique image and video processing and efficient remote monitoring, the MX1-10FEP-D meets the requirements for use in critical applications with the highest demands on reliability. Proven applications in industrial environments include machine vision, motion sensors and system monitoring.

Flexible connection options and high resistance

The MX1-10FEP-D offers in each version a DisplayPort 1.2, a DVI-I as well as a HDMI 1.4 connection and is best suited for three independent displays, for example for digital signage or multimedia scenarios. Up to 32GB DDR4 RAM and three HDD or SSD hard disks per SATA III can be installed (and additionally two mSATA modules). Temperature fluctuations in the extended range from -40 to +70 °C (with 35W TDP processor) as well as shocks and vibrations are no problem for the industrial computers. The series can be operated with power supplies in a voltage range of 9-48V and thus offers flexibility for many different application scenarios. Four USB 3.1 ports, two USB 3.0 as well as two USB 2.0 ports, two RJ-45 and two COM ports also offer plenty of connection possibilities for additional devices.

Specifications

MX1-10FEP-D Series
Processor Intel® Xeon® 9th/8th Gen, LGA1151 Sockel, 6-core TDP Max. 80W
Intel® Core™ i7/i5/i3 9th/8th Gen, 6-core TDP Max. 65W, LGA1151 socket processor,
Intel® Core™ i9 8-core TDP Max. 35W
Chipset Intel® C246
RAM Up to 32GB DDR4 2666MHz, 2 x 260-pin SO-DIMM, (Xeon®: ECC; Core™: Non-ECC)
Memory 3 x 2.5″ HDD / SSD (1x removable HDD, 2x internal HDDs)
2 x mSATA
Interface 2x RS232/422/485 (supports 5V / 12V)
4x USB 3.1 Gen 2 (10 Gbps)
2x USB 3.0
2 x USB 2.0 Ports
1x USB 2.0 Port (internal)
1x Mic-in / 1 x Line-out
1x PS/2
4x SMA Antenna (optional for WiFi/LTE function)
2x RJ-45 (Intel® I219-LM Giga LAN + I210-IT Giga LAN)
1x HDMI 1.4
1x DisplayPort 1.2
1x DVI-I
2x SIM Card Slot
1x 2-Pin Terminal Block Remote Power Reset
1x 3-Pin Terminal Block Power Input
1x 4-Pin Terminal Block External Fan Connector
1x 2-Pin Terminal Block Remote Power On / Off
Expansion Memory: M.2 2242 / 2260 / 2280 M key (PCIe X4 / SATA)
Storage/LTE/Wireless: 2 x Mini PCIe Full / Half size (USB / PCIe / SATA), w/ SIM Karte
Wireless: M.2 2230 E key (PCIe / USB)PCIe 3.0 X16, PCIe 3.0 X1 (Optional: 2 x PCIe 3.0 X8)
Environment Operating temp. with 35W TDP CPU: -40°C ~ 70°C
Operating temp. with 51~65W TDP CPU: -40°C ~ 50°C
Operating temp. with 71~80W TDP CPU: -40°C ~ 40°C
Hummidity: 10%~90% , non-condensing
Vibration: operating – 5 Grms, 5-500 Hz, 3 axes (with SSD, according to IEC60068-2-64)
Shock: operating, 50 Grms, half sine 11 ms duration (with SSD, according to IEC60068-2-27)
Safety: LVD,EN60950-1 / EN62368-1
Mechanics Dimensions (W x D x H): 268 x 246 mm x 128 mm
Mounting Wall-Mount mit (optional)
Certificates EMC: CE/ FCC

Ordering information

MX1-10FEP-D-C246-FL MX1-10FEP-D-C246-FL-AC300 MX1-10FEP-D-C246-IF-AC300 MX1-10FEP-D-C246-IEF-AC300
PCIe Slots x16 + x1
Fan Fanless Fanless 2x internal system fan 2x internal system fan
1x external system fan
Power 9~48V Wide Rage DC Input w/ Terminal Block Connectivity
AC Adaptor 300W AC to DC Adaptor 300W AC to DC Adaptor 300W AC to DC Adaptor

Documents

Datasheet

Accessories & Related products

  • MVP-6000 Series

    • Intel®  Core™ i7/i5/i3 6th Gen
    • Up to 32 GB DDR4 2133 SODIMM
    • 1x PCIe, 1x PCI, 1x mini PCIe
    • 3x Intel® GbE Ports
    • Operating temp.: 0 °C ~ 50 °C
    • Dimensions: 220 x 210 x 170mm
  • MXE-5600 Series

    • Intel® Xeon®/ Core™ 9th/8th Gen
    • Up to 32 GB DDR4 2400 SDRAM
    • Up to 2x PCIe x4, 1x PCIe x16, 1x PCI
    • 2x 2.5″ SATA, CFast, M.2 2280
    • Operating temp.: -20 °C ~ 70 °C
    • Dimensions: 210 x 240 x 86mm
  • MVP-5100-MXM Series

    • Intel® Core™ i7/i5/i3 9th Gen
    • Up to 32 GB DDR4 2133 SDRAM
    • NVIDIA® Quadro® Embbeded P Series
    • 2x 2.5″ SATA M.2 2280 Drive Bays
    • Operating temp.: -20 °C ~ 60 °C
    • Dimensions: 125 x 240 x 210mm
Go to Top