- AMD Ryzen™ V1605B/ V1807B
- Up to 16 GB DDR4-2400/ -3200
- AMD Radeon™ RX Vega
- 4x Gigabit PoE+ Ports
- Operating temp.: -25°C ~ 70 °C
- Dimensions: 64/81 x 116/118 x 176mm
Description
POC-500 Series – Strong computing power and robust design
The POC-500 series is equipped with an AMD Ryzen™ Embedded V1000 processor with 4 cores/8 threads. The built-in GPU delivers a performance of 3.6 TFLOPS in the FP16 benchmark test. Especially on the POC-500 series, that an M.2 2280 NVMe-SSD (PCIe Gen3 x2) is integrated in this compact device.
The series can be DIN rail mounted and has numerous I/O ports accessible from the front panel. In addition, despite its compact design of 63 x 176 x 116 mm, the series offers 4 PoE+ ports, 4 USB 3.0 ports and 4 COM ports. The data ports are also equipped with a screw mechanism that prevents the cables from being pulled out. Within the systems, a choice can be made between two CPUs: the V1807B (45 W) variant is designed for the highest computing power requirements, and the V1605B (15 W) variant is specially designed for fanless operation in harsh operating environments.
The series consists of ultra-compact embedded controllers, with a special I/O design that is particularly robust and offers significantly more CPU or GPU power, making it ideal for a wide range of applications.
Supported MezIO™ modules
The MezIO™ module processes both computer signals (data bus) and control signals via a high-speed connection. It also has a power supply. This module turns the models into application-specific systems with application-oriented I/O components such as RS-232/422/485, isolated DIO and ignition control.
Specifications
| POC-500 Series | |
|---|---|
| Processor | AMD Ryzen™ Embedded V1605B CPU (POC-515) AMD Ryzen™ Embedded V1807B CPU (POC545) |
| GPU | AMD Radeon™ RX Vega 8 mit 8 Compute Units (POC-515) AMD Radeon™ RX Vega 11 mit 11 Compute Units (POC-545) |
| RAM | 1x SODIMM Sockel für DDR4-2400, max. 16GB (POC-515) 1x SODIMM Sockel für DDR4-3200, max. 16GB (POC-545) |
| Memory | 1x M.2 2280 M key NVMe socket (PCIe Gen3 x2) for NVMe SSD Installation |
| Interface | 4x Gigabit Ethernet Ports by Intel® I350-AM4 controller with screw lock IEEE 802.3at PoE+ at Ports #1~ 4 4x USB 3.0 Ports with scre lock 1x VGA 1x Display Port 1x RS-232/ 422/ 485 Ports (COM1) 3x 3-wire RS-232 Ports (COM2/ 3/ 4) oder 1x RS-422/ 485 Port (COM2) 1x Mic-In and Speaker-Out |
| Expansion | 1x Full-Size mini PCI Express socket with internal SIM socket 1x MezIO™ Expansion-Interface for Neousys MezIO™ module |
| Environment | Operating temp.: -25°C ~ 70°C */** Storage temp.: -40° ~ 85°C Hummidity: 10%~90% , non-condensing Vibration: Working, MIL-STD-810G, Method 514.6, Category 4 Shock: Working, MIL-STD-810G, Method 516.6, Procedure I, Table 516.6-II |
| Mechanics | Dimensions POC-515 (W x D x H): 64 x 116 x 176 mm Weight POC-545: 1.2kg Dimensions POC-545 (W x D x H): 82 x 118 x 176 mm Weight POC-545: 1.4kg |
| Mounting | Wall-Mount (optional) DIIN-Rail (standard) |
| Certificates | CE/FCC Class A, according to EN 55022, EN 55024 & EN 55032 |
| * For operating temperatures below zero and above 60°C a HDD or Solid State Disk (SSD) with wide temperature is required. ** For POC-545, operating temperature is up to 70°C only when an externally accessible fan is installed. |
Ordering information
| POC-515 | POC-516 | POC-545 | POC-546 | |
|---|---|---|---|---|
| Processor | AMD Ryzen™ V1605B CPU ( 4C/ 8T, 2M Cache, 2.0/ 3.6 GHz, 12W – 25W TDP | AMD Ryzen™ V1605B CPU ( 4C/ 8T, 2M Cache, 2.0/ 3.6 GHz, 12W – 25W TDP | AMD Ryzen™ V1807B CPU ( 4C/ 8T, 2M Cache, 3.35/ 3.8 GHz, 35W – 54W TDP) | AMD Ryzen™ V1807B CPU ( 4C/ 8T, 2M Cache, 3.35/ 3.8 GHz, 35W – 54W TDP) |
| Features | 4x PoE+ Ports 4x USB 3.1 MezIO™ Interface |
4x PoE+ Ports 4x USB 3.1 MezIO™ R12 |
24x PoE+ Ports 4x USB 3.1 MezIO™ Interface |
4x PoE+ Ports 4x USB 3.1 MezIO™ R12 |
| Dimensions and Weight | 64 x 116 x 176 mm 1.2kg |
64 x 116 x 176 mm 1.2kg |
82 x 118 x 176 mm 1.4kg |
82 x 118 x 176 mm 1.4kg |
