- Intel® Core™/ Xeon® 9th/8th Gen
- Up to 32GB DDR4 2666MHz RAM
- 3x 2.5″ SATA Drive Bays
- With fan or fanless
- Operating temp.: -40 °C ~ 70 °C
- Dimensions: 268 x 128 x 246mm
FEATURES
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Product: MX1-10FEP-D Series
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Product: MX1-10FEP-D Series
SKU:
Description
MX1-10FEP-D Series – Fanless sturdy design
The fanless embedded GPU computing platforms of the MX1-10FEP-D series are based on Intel® Xeon® or Core™ processors of the ninth or eighth generation and are optimized for applications in industrial automation and machine control. The MX1-10FEP-D combines high-performance computing, scalable functions and versatile interfaces as well as industrial-grade reliability on a fanless platform and offers reliable long-term operation for performance-critical applications in industrial automation, visualization and computationally intensive processes. The Embedded PC series consists of a classically robust design. The Embedded PCs support DDR4 memory via dual SODIMM slots, both non-ECC and ECC.
High performance for industrial requirements
The embedded systems combine outstanding performance with extensive connectivity and are easy to use. The robust housing allows the use under difficult conditions. With the use of a LGA1151 socket, optionally with Intel® Xeon® Coffee Lake or Core™ i3, i5, i7 or even i9 processor of the current generation, the embedded computer focuses on high performance with minimal power consumption. Together with unique image and video processing and efficient remote monitoring, the MX1-10FEP-D meets the requirements for use in critical applications with the highest demands on reliability. Proven applications in industrial environments include machine vision, motion sensors and system monitoring.
Flexible connection options and high resistance
The MX1-10FEP-D offers in each version a DisplayPort 1.2, a DVI-I as well as a HDMI 1.4 connection and is best suited for three independent displays, for example for digital signage or multimedia scenarios. Up to 32GB DDR4 RAM and three HDD or SSD hard disks per SATA III can be installed (and additionally two mSATA modules). Temperature fluctuations in the extended range from -40 to +70 °C (with 35W TDP processor) as well as shocks and vibrations are no problem for the industrial computers. The series can be operated with power supplies in a voltage range of 9-48V and thus offers flexibility for many different application scenarios. Four USB 3.1 ports, two USB 3.0 as well as two USB 2.0 ports, two RJ-45 and two COM ports also offer plenty of connection possibilities for additional devices.
Specifications
MX1-10FEP-D Series | |
---|---|
Processor | Intel® Xeon® 9th/8th Gen, LGA1151 Sockel, 6-core TDP Max. 80W Intel® Core™ i7/i5/i3 9th/8th Gen, 6-core TDP Max. 65W, LGA1151 socket processor, Intel® Core™ i9 8-core TDP Max. 35W |
Chipset | Intel® C246 |
RAM | Up to 32GB DDR4 2666MHz, 2 x 260-pin SO-DIMM, (Xeon®: ECC; Core™: Non-ECC) |
Memory | 3 x 2.5″ HDD / SSD (1x removable HDD, 2x internal HDDs) 2 x mSATA |
Interface | 2x RS232/422/485 (supports 5V / 12V) 4x USB 3.1 Gen 2 (10 Gbps) 2x USB 3.0 2 x USB 2.0 Ports 1x USB 2.0 Port (internal) 1x Mic-in / 1 x Line-out 1x PS/2 4x SMA Antenna (optional for WiFi/LTE function) 2x RJ-45 (Intel® I219-LM Giga LAN + I210-IT Giga LAN) 1x HDMI 1.4 1x DisplayPort 1.2 1x DVI-I 2x SIM Card Slot 1x 2-Pin Terminal Block Remote Power Reset 1x 3-Pin Terminal Block Power Input 1x 4-Pin Terminal Block External Fan Connector 1x 2-Pin Terminal Block Remote Power On / Off |
Expansion | Memory: M.2 2242 / 2260 / 2280 M key (PCIe X4 / SATA) Storage/LTE/Wireless: 2 x Mini PCIe Full / Half size (USB / PCIe / SATA), w/ SIM Karte Wireless: M.2 2230 E key (PCIe / USB)PCIe 3.0 X16, PCIe 3.0 X1 (Optional: 2 x PCIe 3.0 X8) |
Environment | Operating temp. with 35W TDP CPU: -40°C ~ 70°C Operating temp. with 51~65W TDP CPU: -40°C ~ 50°C Operating temp. with 71~80W TDP CPU: -40°C ~ 40°C Hummidity: 10%~90% , non-condensing Vibration: operating – 5 Grms, 5-500 Hz, 3 axes (with SSD, according to IEC60068-2-64) Shock: operating, 50 Grms, half sine 11 ms duration (with SSD, according to IEC60068-2-27) Safety: LVD,EN60950-1 / EN62368-1 |
Mechanics | Dimensions (W x D x H): 268 x 246 mm x 128 mm |
Mounting | Wall-Mount mit (optional) |
Certificates | EMC: CE/ FCC |
Ordering information
MX1-10FEP-D-C246-FL | MX1-10FEP-D-C246-FL-AC300 | MX1-10FEP-D-C246-IF-AC300 | MX1-10FEP-D-C246-IEF-AC300 | |
---|---|---|---|---|
PCIe Slots | x16 + x1 | |||
Fan | Fanless | Fanless | 2x internal system fan | 2x internal system fan 1x external system fan |
Power | 9~48V Wide Rage DC Input w/ Terminal Block Connectivity | |||
AC Adaptor | – | 300W AC to DC Adaptor | 300W AC to DC Adaptor | 300W AC to DC Adaptor |
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- Operating temp.: 0 °C ~ 50 °C
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MXE-5600 Series
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- Up to 2x PCIe x4, 1x PCIe x16, 1x PCI
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