- Scalable NXP i.MX 93 single/dual SOM platform
- Pre-certified dual-band Wi-Fi 6 (802.11ax) and Bluetooth 5.2
- Low-profile Digi SMTplus™
- Cellular modem and Digi XBee® integration
- Digi Embedded Yocto Linux support
- Digi Part No.: CC-WMX93-KIT
Description
Digi ConnectCore® 93 development kit with development board , i.MX 93 dual-core, NPU, 8GB eMMC, 1 GB LPDDR4 wireless SOM
The Digi ConnectCore® 93 Development Kit features a tightly integrated, secure, industrial-specified system-on-module (SOM) platform, based on the NXP® i.MX 93 application processor, with Wi-Fi 6 and Bluetooth® 5.2 wireless connectivity. The kit supports development of a wide range of medical, industrial, energy, and transportation applications, including Internet of Things (IoT), automation, human-machine interface (HMI), equipment monitoring, audio/voice, edge computing and machine learning (e.g. anomaly detection).
Digi ConnectCore 93 features up to two power-efficient Arm® Cortex®-A55 cores, with a Cortex-M33 core, AI/ML Arm Ethos U6 NPU and NXP PMIC for maximum power efficiency. This SOM is designed for industrial reliability and 10+ year product lifecycles.
Digi ConnectCore Cloud Services, Digi ConnectCore Security Services and Expert Support provide additional capabilities for development, deployment and maintenance. The ConnectCore SOM solution provides ready-to-use building blocks, a complete, embedded Linux software platform based on the Yocto® Project, and development tools. This helps OEMs lower research and development costs, realize a lower total cost of ownership, and streamline time-to-market.
Embedded device security is a critical design aspect for the growing number of connected IoT applications. Digi ConnectCore SOM solutions provide built-in security with Digi TrustFence®, a fully integrated device-security framework simplifying the process of securing connected devices. With twenty years of embedded SOM experience enabling millions of globally connected products, Digi is a trusted embedded and IoT solutions provider, simplifying the way customers design, build and deploy connected applications. Digi Wireless Design Services (WDS) offer additional support, certification assistance, and custom design services to get your products to market smarter and faster.
The kit includes:
- Digi ConnectCore® 93 development board with i.MX 93 dual-core, NPU, 8 GB eMMC, 1 GB LPDDR4 wireless SOM
- Console port cable
- Dual-band wireless antenna
- Power supply and accessories
- Reference designs and online documentation
Features and benefits:
- Digi ConnectCore 93 wireless system-on-module
- NXP i.MX 93
- Dual Cortex®-A55 cores at 1.7 GHz
- Cortex®-M33 at 250 MHz for real-time processing
- AI/ML Arm Ethos U65 micro neural processor
- Pre-certified dual-band Wi-Fi 6 802.11ax and Bluetooth® 5.2
- 2x 10/100/1000M Ethernet with EEE, AVB and IEEE 1588 (1x TSN)
- 8 GB SLC eMMC, 1 GB LLPDDR4
- Built-in Digi TrustFence® device security, identity and privacyy
- Cloud and edge compute services integration
- Seamless cellular modem and Digi XBee® integration
- Digi Embedded Yocto Linux support
- Industrial operating temperature: −40 to 85° C (−40 to 185° F); depending on use case and enclosure/system design
- Digi Microcontroller Assist™ for advanced power management, security, peripheral support and system reliability
- Remote monitoring, device management and IoT application enablement with Digi ConnectCore Cloud Services
- Turnkey development services available from Digi WDS
Digi Part No.: CC-WMX93-KIT
Specifications
| Digi ConnectCore® 93 | |
|---|---|
| Application Processor | NXP® i.MX 93: – Up to 2x Cortex®-A55 cores at 1.7 GHz – 1x Cortex-M33 core at 250 MHz core for real-time processing |
| Memory | Up to 32 GB flash (eMMC), up to 2 GB LPDDR4 / LPDDR4X (16-bit) |
| NPU | AI/ML Arm® Ethos U65 micro neural processor |
| PMIC | NXP PCA9451 |
| Graphics/Display | 2D GPU: – Blended/composition – Resize – Color space conversion1x 1080p 60 MIPI DSI (4-lane, 1.5 Gbps/lane) with PHY 1x 720p 60 LVDS (4-lane) 18-bit parallel RGB |
| Camera | 1x 1080p 60 MIPI-CSI (2-lane, 1.5 Gbps/lane) with PHY 8-bit parallel YUV/RGB |
| Security | Digi TrustFence®: secure boot, filesystem encryption, tamper detection, secure JTAG, secure console, secure build environments, secure firmware updates; EdgeLock secure enclave: crypto, tamper detection, secure clock, secure boot, eFuse key storage, random number; Arm TrustZone (Cortex-A and Cortex-M) |
| Peripherals/Interfaces | 2x USB 2.0 OTG controllers with integrated PHY interfaces 1x Ultra Secure Digital Host Controller (uSDHC) interfaces 8x Low Power Universal Asynchronous Receiver / Transmitter (LPUART) modules 8x Low Power I2C modules, 2x I3C 8x Low Power SPI (LPSPI) modules 2x FlexCAN with flexible data-rate (FD) support 4x pulse-width modulator (PWM) with 16-bit counter 1x 12-bit ADC module with accurate internal voltage reference, up to 4 channels 3x Synchronous Audio Interface (SAI) modules (up to 4 lanes) supporting I2S, AC97, TDM, codec/DSP and DSD interfaces 1x S/PDIF input and output, including a raw capture input mode 8-channel Pulse Density Modulation (PDM) input Up to 112 GPIOs |
| Ethernet | 2x 10/100/1000M Ethernet with EEE, AVB and IEEE 1588 (1x TSN) |
| Wi-Fi | Wi-Fi 6 802.11ax dual-band 1×1 wireless |
| Bluetooth | Bluetooth® 5.2 |
| 802.15.4 | 802.15.4 (optional) |
| Microcontroller assist | Digi Microcontroller Assist™ for advanced power management, security, peripheral support and system reliability (optional) – Independent Cortex-M0+ microcontroller subsystem – Supporting ultra-low power modes at <2.5 µA |
| Operating Temperature | Industrial: −40 °C to 85 °C (−40 °F to 185 °F); depending on use case and enclosure/system design |
| Storage Temperature | −50 °C to 125 °C (−58 °F to 257 °F) |
| Humidity | 5 ~ 90%; non-condensing |
| Radio Approvals | US, Canada, EU, Japan, Australia/New Zealand, Brazil, Mexico |
| Emissions/Immunity/Safety | FCC Part 15 Class B, EN 55022 Class B, EN 61000-3-2, EN 61000-3-3, ICES- 003 Class B, VCCI Class II, AS 3548, FCC Part 15 Subpart C Section 15.247, IC (Industry Canada), RSS-210 Issue 5 Section 6.2.2(o), EN 300 328, EN 301 489-17, EN 55024, EN 301 489-3, Safety (IEC 62368-1); visit www.digi.com/resources/certifications for latest updates |
| Design Verification | Temperature: IEC 60068-2-1, IEC 60068-2-2, IEC 60068-2-78 Vibration/shock: IEC 60068-2-6, IEC 60068-2-64, IEC 60068-2-27, HALT |
| Mounting/Pin Count | 118 castellated vias, LGA-474, 1.27 mm pitch, 40 mm x 45 mm x 3.5 mm (1.6 in x 1.8 in x 0.1 in) |
| Dimensions | 118 castellated vias, LGA-474, 1.27 mm pitch, 40 mm x 45 mm x 3.5 mm (1.6 in x 1.8 in x 0.1 in) |
| Product Warranty | 3 years |
Part Numbers & Accessories
| Kits | |
|---|---|
| CC-WMX93-KIT | Digi ConnectCore 93 Development kit
|
| Modules | |
|---|---|
| CC-WMX-YC7D-KN | Digi ConnectCore 93 System-on-Module – dual-core, NPU, wireless
|
| CC-MX-YC7D-ZN | Digi ConnectCore 93 System-on-Module – dual-core, NPU, Ethernet
|
| CC-WMX-ZC6D-L1 | Digi ConnectCore 93 System-On-Module – single-core, wireless
|
| CC-MX-ZC6D-Z1 | Digi ConnectCore 93 System-On-Module – single-core, Ethernet
|
| Accessories | |
|---|---|
| CC-ACC-LCDH-10 | LCD Application Kit, including 10 in WXGA (high resolution) LCD panel |
